Features Feature Description Process Description Application Description Application Areas Categories

Features

●Used in advanced wafer laser slotting of semiconductors
●Laser protective film for heat dissipation, heat resistance, cooling, lubrication, and splash prevention
●Excellent heat dissipation, heat resistance and cooling
●Good lubricating properties and is easy to process, handle and clean

Feature Description

The laser protective film is a versatile composite that prevents the dicing splash from damaging the Wafer surface. Its excellent heat dissipation, heat resistance and cooling functions can reduce thermal effects, effectively prevent chipped debris from splashing onto the surface of the wafer, and prevent thermal energy of the laser from spreading and enlarging the dicing line. It is easy to clean and remove from the wafer surface after dicing.

Process Description

The laser protective film is uniformly sprayed or coated on the surface of the wafer (LED or semiconductor) before laser dicing.

Application Description

● Semiconductor wafer dicing
● LED wafer dicing
● Glass panel dicing
Application Areas
Categories
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